Chongqing - Guangzhou Aosong Electronics Co., Ltd., a leader in the sensor industry and parent of Aosong Semiconductor (Chongqing) Co., Ltd., has recently completed its Series D funding round, raising 700 million yuan.
In June 2023, Aosong Semiconductor began construction on its 8-inch MEMS specialty chip IDM industrial base in Western (Chongqing) Science City, with a total investment of 3.5 billion yuan and a vast area covering 200 acres.
The facility will feature a production line for 8-inch CMOS+MEMS specialty sensor chips, a rapid research and development line for 8-inch MEMS wafers, an innovation research center for intelligent sensors in the Chengdu-Chongqing economic circle, and a reliability testing center for automotive-grade sensors.
This is set to enhance Aosong's technological capabilities, enabling the development and mass production of a wide range of MEMS sensors.
The project aims to facilitate comprehensive research and production across surface silicon, bulk silicon, and emerging processes and systems.
It will incorporate advanced MEMS technologies, including piezoresistive, piezoelectric, silicon photonic, magnetic materials, MOX, and microfluidics, significantly increasing the success rate of product development and ensuring a seamless transition from R&D to mass production.
Han Shuiping, Vice General Manager and Board Secretary of Aosong Semiconductor (Chongqing) indicated that the construction of the 8-inch MEMS specialty semiconductor IDM industrial base is advancing quickly, with the core building structure being erected at an accelerated pace.
The wafer production plant and power station are expected to be completed by the end of the year, with advanced MEMS equipment scheduled for installation and commissioning by early 2025. This strategic rollout aims to ensure optimal operational readiness for production.
Simultaneously, the company has established a research and development team, supported by a marketing team and specialized Field Application Engineers (FAE), to deliver comprehensive solutions and after-sales support for diverse market applications.
This will facilitate efficiently converting technological achievements into market-ready applications, ensuring quick responses to market demands.
Zhang Bin, Chairman of Aosong Semiconductor, emphasized that the completed project will offer collaboration opportunities in MEMS specialty semiconductor chip development, equipment sharing, and technical support to relevant domestic and international industries.
Zhang added that by fostering joint R&D, process integration, production alignment, and project cultivation, the company aims to lead technological advancements and enhance the commercialization of its innovations.
Moreover, the project is set to supply essential components for strategic pillar industries and emerging sectors, including automotive, rail transportation, biomedical, smart home appliances, intelligent robotics, high-end equipment manufacturing, precision instruments, smart grids, and the Internet of Things (IoT).